Method of manufacturing a semiconductor integrated circuit device that includes forming dummy patterns in an isolation region prior to filling with insulating material

ABSTRACT

A method for manufacturing a semiconductor integrated circuit device includes the steps of forming an isolation trench in an isolation region of a semiconductor substrate, filling the isolation trench up to predetermined middle position in its depth direction with a first insulating film deposited by a coating method, filling a remaining depth portion of the isolation trench into which the first insulating film is filled with a second insulating film, then forming a plurality of patterns on the semiconductor substrate, filling a trench forming between the plurality of patterns up to predetermined middle position in a trench depth direction with a third insulating film deposited by a coating method, and filling a remaining portion of the trench into which the third insulating film is filled with a fourth insulating film that is more difficult to etch than the third insulating film. The method may also include the step of forming dummy patters in a relatively large isolation region of isolation regions with relatively different planar dimensions before the first insulating film is deposited.

FIELD OF THE INVENTION

This application is a Continuation application of application Ser. No.11/055,745, filed Feb. 11, 2005, which is a Continuation application ofapplication Ser. No. 10/721,230, filed Nov. 26, 2003, now abandonedwhich is a Continuation application of application Ser. No. 09/709,403,filed Nov. 13, 2000, now U.S. Pat. No. 6,693,008, issued Feb. 17, 2004.The contents of application Ser. No. 09/709,403, filed Nov. 13, 2000,are incorporated herein by reference in their entirety.

FIELD OF THE INVENTION

This invention relates to a method of manufacturing a semiconductorintegrated circuit device and to a semiconductor integrated circuitdevice; and, more particularly, the invention relates to a technologysuitable for use in a method of manufacturing a semiconductor integratedcircuit device having a trench isolation portion and which is alsoapplicable to a semiconductor integrated circuit device having a trenchisolation portion.

BACKGROUND OF THE INVENTION

Instead of element isolation technologies based on the local oxidizationof silicon (LOCOS) method, a trench filled type element isolationtechnology has been developed which provides an increase in the capacityof the elements. According to such technology, after an isolation trenchis formed on a semiconductor substrate by etching, an insulating film isdeposited on a main surface of the semiconductor substrate by a CVDmethod. By filling the isolation trench, an element isolation portion isformed. To form the insulating film (or isolation film) for filling theisolation trench, for example, a mixture gas of tetraethoxysilane (TEOS)and ozone (O₃) may be used. Alternatively, the insulating film may beformed by causing decomposition reaction between monosilane and oxygenthrough use of a high-density plasma.

The technology is described in Japanese Patent Laid-open No.235157/1993, which discloses a technology for filling an insulating filminto field regions with different widths.

SUMMARY OF THE INVENTION

The present inventor has realized that a problem exists in thetechnology for filling the isolation trench. In this regard, with anincrease in fineness of the insulation trench, the isolation trench cannot be fully filled with the isolation film, leaving un-filled portionsas holes. When flattening the isolation trench after the fillingprocess, the holes left in the isolation trench are exposed to a surfaceof the isolation trench. Due to electrode material left in the holesduring electrode formation thereafter, failures, such as a short betweenelectrode wires, are caused. As a result, the reliability and yield ofthe semiconductor integrated circuit device are deteriorated.

It is an object of the present invention to provide a technology whichmakes it possible to fill an insulating film into an isolation trenchfully without forming holes on top of the insulating film filled withinthe isolation trench.

Also, it is another object of the present invention to provide atechnology which makes it possible to fill an insulating film into atrench formed between adjacent patterns fully without forming holes ontop of the insulating film filled within the trench.

These and other objects and novel features of the present invention willbe apparent from the description herein and the accompanying drawings.

Typical effects obtained by the present invention disclosed herein maybe described simply as follows:

The present invention includes the step of filling an isolation trenchformed on a semiconductor substrate by filling it up to a predeterminedmiddle depth with an insulating film formed by a coating method and thenstacking an insulating film thereon.

The present invention includes the step of filling an isolation trenchformed on a semiconductor substrate by filling it up to a predeterminedmiddle depth with an insulating film formed by a coating method and thenstacking an insulating film formed by a chemical vapor deposition methodthereon.

The present invention includes the step of filling a trench formedbetween adjacent patterns formed on a semiconductor substrate by fillingit up to a predetermined middle depth with an insulating film formed bya coating method and sequentially stacking an insulating film formed bya chemical vapor deposition method thereon.

The present invention includes the steps of forming dummy patterns inone isolation region with a relatively large planer area of isolationregions with relatively different planar areas on a semiconductorsubstrate and filling an isolation trench formed on each of theisolation regions with relatively different planar areas on asemiconductor substrate by filling it up to a predetermined middle depthwith an insulating film formed by a coating method and sequentiallystacking an insulating film formed by a chemical vapor deposition methodthereon.

The present invention includes the steps of forming a plurality ofpatterns, which are adjacent to each other, on a semiconductorsubstrate; filling a trench formed between the plurality of patterns,which are adjacent to each other, up to a predetermined middle positionin its depth direction with a first insulating film deposited by acoating method; and filling a remaining depth portion of the trench intowhich the first insulating film is filled with a second insulating film.

In the manufacturing method, the plurality of patterns include a MISFETgate electrode and a dummy gate electrode, or an element isolationtrench and a dummy pattern.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of one embodiment of a semiconductor integratedcircuit device during production according to the present invention;

FIG. 2 is a sectional view of the semiconductor integrated circuitdevice taken on line A—A in FIG. 1;

FIG. 3 is a sectional view of the semiconductor integrated circuitdevice taken on line B—B in FIG. 1;

FIG. 4 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 2 and 3,taken on line A—A in FIG. 1;

FIG. 5 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 2 and 3,taken on line B—B in FIG. 1;

FIG. 6 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 4 and 5,taken on line A—A in FIG. 1;

FIG. 7 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 4 and 5taken on line B—B in FIG. 1;

FIG. 8 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 6 and 7taken on line A—A in FIG. 1;

FIG. 9 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 6 and 7taken on line B—B in FIG. 1;

FIG. 10 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 8 and 9taken on line A—A in FIG. 1;

FIG. 11 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 8 and 9taken on line B—B in FIG. 1;

FIG. 12 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 10 and 11taken on line A—A in FIG. 1;

FIG. 13 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 10 and 11taken on line B—B in FIG. 1;

FIG. 14 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 12 and 13taken on line A—A in FIG. 1;

FIG. 15 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 12 and 13taken on line B—B in FIG. 1;

FIG. 16 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 14 and 15taken on line A—A in FIG. 1;

FIG. 17 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 14 and 15taken on line B—B in FIG. 1;

FIG. 18 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 16 and 17taken on line A—A in FIG. 1;

FIG. 19 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 16 and 17taken on line B—B in FIG. 1;

FIG. 20 is an essential portion top view of the semiconductor integratedcircuit device, during a production step subsequent to that of FIGS. 18and 19;

FIG. 21 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIGS. 18 and 19taken on line A—A in FIG. 20;

FIG. 22 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIG. 21 taken online A—A in FIG. 20;

FIG. 23 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIG. 22 taken online A—A in FIG. 20;

FIG. 24 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIG. 23 taken online A—A in FIG. 20;

FIG. 25 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIG. 24 taken online A—A in FIG. 20;

FIG. 26 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIG. 25 taken online A—A in FIG. 20;

FIG. 27 is a top view of the semiconductor integrated circuit deviceduring a production step subsequent to FIG. 26.

FIG. 28 is a sectional view taken on line A—A in FIG. 27.

FIG. 29 is a top view of another embodiment of a semiconductorintegrated circuit device during production according to the presentinvention;

FIG. 30 is a sectional view taken on line A—A in FIG. 29.

FIG. 31 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIG. 30 taken online A—A in FIG. 29;

FIG. 32 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIG. 31 taken online A—A in FIG. 29;

FIG. 33 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIG. 32 taken online A—A in FIG. 29;

FIG. 34 is a sectional view of the semiconductor integrated circuitdevice, during a production step subsequent to that of FIG. 32 taken online A—A in FIG. 29;

FIG. 35 is a sectional view of a semiconductor integrated circuit deviceduring production illustrating technologies reviewed by the presentinventor for making the present invention; and

FIG. 36 is a sectional view of another embodiment of a semiconductorintegrated circuit device during production according to the presentinvention.

DESCRIPTION OF PREFERRED EMBODIMENTS

Embodiments of the present invention will be described in detail withreference to the drawings. In all of the drawings used in thedescription of the embodiments, identical reference numerals will begiven to those elements having identical functions, and repetitivedescriptions will be omitted. Also, in the embodiments described herein,pMIS stands for a p-channel type metal insulator semiconductor fieldeffect transistor (MISFET) while nMIS stands for an n-channel typeMISFET.

First Embodiment

As a first embodiment, a description will be given of a case where thepresent invention is applied to a method of manufacturing a 1 giga(G)bit dynamic random access memory (DRAM), for example. It should beunderstood that it is not intended that the present invention be limitedto application to a 1 Gbit DRAM, and it should be clear that theinvention may be applied to other various semiconductor integratedcircuit devices, such as an ASIC (Application Specific IC) including a256 Mbit DRAM, a logic circuit with a DRAM or a complementary MOS (CMOS)circuit.

First of all a method for forming an isolation portion of the DRAM willbe described with reference to FIGS. 1 to 19. FIG. 1 shows a top view ofa memory cell array during a process for manufacturing a DRAM; FIGS. 2,4, 6, 8, 10, 12, 14, 16, and 18 show sectional views of FIG. 1 taken online A—A; and FIGS. 3, 5, 7, 9, 11, 13, 15, 17 and 19 show sectionalviews of FIG. 1 taken on line B—B.

As shown in FIGS. 1 to 3, an insulating film 2 made of silicon oxide(SiO₂), for example, is formed by a thermal oxidization method, forexample, on a surface of a semiconductor substrate 1 (semiconductorwafer made of a thin plate having a planar, substantially circular shapeat this point) made of p-type single crystal silicon with about 10 Ocmresistance. This insulating film 2 has the ability to relax stressduring the thermal processing. Then, an insulating film 3 made ofsilicon nitride (Si₃N₄), for example, is formed by a chemical vapordeposition (CVD) method, for example, on the insulating film 2. Then,using the photolithography technique, a photo-resist film 4A is formedthereon, such that an isolation portion formed region with trench filledstructure is exposed and an active region is covered. Subsequently, thephoto-resist film 4A is used as in etching mask to etch and remove theinsulating films 2 and 3, which are exposed from the photo-resist film4A, by the dry-etching method, for example. Then, the photo-resist film4A is removed. Thus, as shown in FIGS. 4 and 5, a trench opening 5 isformed where the isolation portion formed region is exposed and theactive region is covered.

Next, the insulating film 3 left on the semiconductor substrate 1 isused as a etching mask to etch and remove the semiconductor substrate 1,which is exposed from the trench opening 5, by the dry-etching method,for example. Thus, as shown in FIGS. 6 and 7, an isolation trench 6 a isformed on the semiconductor substrate 1. The depth of the isolationtrench 6 a is about 350 nm, for example. Then, by performing thermaloxidation processing, for example, on the semiconductor substrate 1, asshown in FIGS. 8 and 9, an insulating film 6 b made of silicon oxide(SiO₂), for example, is formed on a surface of the semiconductorsubstrate 1 within the isolation trench 6 a. After that, as shown inFIGS. 10 and 11, the isolation trench 6 a is filled on the main surfaceof the semiconductor substrate 1 by depositing a coating film (a firstinsulating film) 6 c, such as an inorganic spin-on glass (SOG) film ofpolysilazane, for example, by th 6 rotary coating method, for example,so as to cover the insulating film 3. The coating film 6 c is made ofsilicon oxide, for example, and has a higher flat property for filling arecessed portion formed by a substrate shape. Further, it is fluid withnot more than 100 mPa□s viscosity coefficient at a temperature of about25 □C., for example. Accordingly, the coating film 6 c has a higherreflow property and an excellent gap-fill property on a fine space.Thus, no void is caused even when it is filled in the isolation trench 6a, which is fine to almost the resolution limit of photolithography.Further, at this point, the top surface of the coating film 6 c issubstantially flat over the entire surface on the main surface of thesemiconductor substrate 1.

Next, as shown in FIGS. 12 and 13, the insulating film 3 is used as anetching mask to etch and remove the coating film 6 c leaving a portionthereof up to predetermined middle position in a depth direction of theisolation trench 6 a. As a result, the isolation trench 6 a getsshallower. Here, a portion of the coating film 6 c is left in theisolation trench 6 a so that the aspect ratio of the isolation trench 5a is not more than 3, for example. Then, thermal processing at 800 □C isperformed on the semiconductor substrate 1 for about one minute in anitrogen gas atmosphere, for example. As a result, the film quality ofthe coating film 6 c can be improved, which reduces its wet-etchingrate. After that, as shown in FIGS. 14 and 15, an insulating film (asecond insulating film) 6 d made of a silicon oxide film, for example,is deposited on the main surface of the semiconductor substrate 1 by theCVD method, for example, using a mixture gas of tetraethoxysilane (TEOS)and ozone (O₃), or a mixture gas of monosilane and oxygen, for example,in order to fill the remaining depth portion of the isolation trench 6a. Here, since the aspect ratio of the isolation trench 6 a (remainingdepth portion) is not more than 3, the isolation trench 5 a can befilled in such a way that no holes, voids, or seams are formed in theinsulating film 6 d within the isolation trench 6 a. Further, the deeperthe isolation trench 6 a is, the more uneven the main surface of thesemiconductor substrate 1 is. Thus, the deposition thickness of theinsulating film 6 d for filling the isolation trench 6 a must be thickerto some extent in order to prevent unevenness on the top surface of theinsulating film 6 d. However, in this first embodiment, the depth of theisolation trench 6 a is reduced by using a coating film 6 c in advanceso that the unevenness on the main surface of the semiconductorsubstrate 1 can be reduced. As a result the deposition thickness of theinsulating film 6 d can be thinner. The insulating film 6 d is finerthan the coating film 6 c. Therefore, even when it is exposed to lightfrom a part of a contact hole described later during formation of thecontact hole, it is difficult to be etched and removed.

Next, as shown in FIGS. 16 and 17, the insulating film 3 is used as anetching-stopper to polish the insulating film 6 d by the chemicalmechanical polishing (CMP) method. Here, according to the firstembodiment, since the deposition thickness of the insulating film 6 dcan be thinner, the amount of polishing of the insulating film 6 d byCMP can be reduced. Thus, the polishing variation of CMP can be reduced.Then, etching processing is performed on the semiconductor substrate 1in order to etch and remove the insulating films 2 and 3. As a result,as shown in FIGS. 18 and 19, an isolation portion 6 with a trench filledstructure is formed. By forming the isolation portion 6, an activeregion L which has a long and narrow island-shaped pattern surrounded bythe isolation portion 6 is formed at the same time in a region Wherememory cells are formed (memory cell array). Also, in a region whereperipheral circuits are formed, an active region, not shown, surroundedby the isolation portion 6 is formed at the same time. The top surfaceof the isolation portion 6, that is, the top surface of the insulatingfilm 6 d, is flattened so as to be at substantially the same level asthe top surface of the active region L. No holes, voids or seams areformed on the top surface portion of the insulating film 6 d.

Next, with reference to FIGS. 20 to 26, an explanation will be given ofa method of forming a gate electrode of the DRAM and an inter-layerinsulating film covering it. FIG. 20 shows a top view of a memory cellarray at the same planar position as in FIG. 1 during a process formanufacturing the DRAM; and FIGS. 21 to 26 show sectional views taken online A—A in FIG. 20, respectively.

First of all, as shown, in FIGS. 20 and 21, phosphorus (P), for example,is ion-implanted into the semiconductor substrate 1 of the memory cellarray in order to form an n-type semiconductor region 7. Then, boron(B), for example, is ion-implanted into the memory cell array and a partof the peripheral circuit (a region where nMIS is formed) in order toform a p-type well 8P. Phosphorus (P), for example, is ion-implantedinto another part of the peripheral circuit (a region where pMIS isformed) in order to form an n-type well. Then, impurities for adjustingthe threshold voltage of the MISFET, such as boron fluoride (BF₂), areion-implanted into the p-type well 8P and the n-type well. Aftercleaning surfaces of the p-type well 8P and the n-type well with acleaning solution of hydrofluoric acid (HF), the semiconductor substrate1 is wet oxidized in order to form a clean gate insulating film 9 madeof silicon oxide, for example, on the surfaces of the p-type well 8P andthe n-type well. After that, gate electrodes 10A (word lines WL) areformed on a top surface of the gate insulating film 9. Each of the gateelectrodes 10A is formed by depositing a polycrystal silicon film, towhich impurities such as P (Phosphorus) are doped, on the semiconductorsubstrate 1 by the CVD method, depositing a tangstenniteride (WN) filmand a tungsten (W) film thereon in order from a bottom layer by asputtering method, depositing an insulating film 11 made of siliconnitride (Si₃N₄), for example, there on by the CVD method, and thenpatterning these films by using a photo-resist film as a mask. Thetangstenniteride film for forming the gate electrode 10A functions as abarrier layer for preventing a highly resistant silicide layer frombeing formed on the interface of the tungsten film and the polycrystalsilicon film when they are reacted during the thermal processing at ahigher temperature. The barrier layer may be a higher melting pointmetal nitride film, such as a titaniteride (TiN) film, as an alternativeto the tangsteniteride film. The electric resistance of the gateelectrode IOA (word line WL) with a polymetal structure including thehigher melting point metal film and the polycrystal silicon film mainlyis lower than that of a gate electrode including a poly crystal siliconfilm or a polycide film (a stacking film of a high melting point metalsilicide film and a polycrystal silicon film). Therefore, signal delaysof the word line WL can be reduced. In the first embodiment, no holes orvoids are formed on the top surface of the isolation portion 6. Thus, itis possible to prevent short circuit failures between adjacent wordlines WL due to material of the word lines WL left in the holes or voidson the top surface of the isolation portion 6 during word line WLpatterning.

Next, P (phosphorus) is ion-implanted into the p-type well 8P to form apair of n-type semiconductor regions 12 for being use as a source and adrain on the p-type well 8P on both sides of the gate electrode 10A.Processes up to this point can substantially complete MISFETQs formemory cell selection. After an insulating film 13 made of siliconnitride (Si₃N₄), for example, is deposited on the main surface of thesemiconductor substrate 1 by the CVD method, the insulating film 13 ofthe memory cell array is covered with a photo-resist film, not shown, toanisotropy-etch the insulating film 13 in the peripheral circuit region.Thus, in the memory cell array, the insulating film 13 is formed so asto cover the surface of the gate electrode 10A and the surface of thesemiconductor substrate 1. Also, in the peripheral circuit region, asidewall spacer is formed on a sidewall of a gate electrode of a MISFETforming the peripheral circuit. This etching is performed by using gasfor etching the insulating film 13 made of silicon nitride, for example,with a higher selecting ratio in order to minimize the amount of gratingof the insulating film 6 d filled in the isolation portion 6.

By the way, the word line WL (that is, gate electrode) has a polymetalstructure as described above. Accordingly, it is longer in size in aheight direction than a word line with a structure formed by apolycrystal silicon film only. In addition, the dimension betweenadjacent word lines is smaller in order to increase the capacity of thememory. Accordingly, the aspect ratio of a trench formed betweenadjacent word lines gets larger. In the first embodiment, for example,the width and depth of the trench formed between adjacent word lines WL(gate electrodes 10A) are about 70 nm and about 300 nm, for example,respectively. Accordingly, the aspect ratio of the trench is 4 or above,for example.

Thus, in the first embodiment, processing is performed as follows:

First of all, as shown in FIG. 22, a coating film (first insulatingfilm) 14 a, such as an inorganic SOG film of silicon oxide, for example,is deposited on the main surface of the semiconductor substrate 1 by therotary coating method in order to fill a trench formed between adjacentword lines WL (that is, gate electrodes 10A). The coating film 14 a isidentical to the coating film 6 c and has a substantially flat topsurface. The coating film 14 a has a higher reflow property than aglass-flow film such as a BPSG film, and is excellent in gap-fillabilityfor finer spaces. Therefore, no voids are created even when it is filledbetween adjacent gate electrodes 10A (word lines WL) which is finealmost up to the resolution limit of photolithography. Further, thecoating film 14 a can obtain a higher reflow property without thermalprocessing at a high temperature for a long period, as required for theBPSG film, for example. Therefore, thermal diffusion of impuritiesimplanted into the source and the drain of the MISFETQs for memory cellselection and the source and the drain of the MISFET (nMIS, PMIS) of theperipheral circuit can be suppressed in order to attain a shallowjunction of the coating film 14 a. Also, oxidation of the metal(tungsten film) forming the gate electrode 10A (word line WL) duringthermal processing can be suppressed. Therefore, the performance of theMISFETQs for memory cell selection and the MISFET of the peripheralcircuit can be higher.

Next, as shown in FIG. 23, the insulating film 13 is used as an etchingmask in order to etch and remove the coating film 14 a leaving a portionthereof up to a predetermined middle position in a depth direction ofthe trench between adjacent word lines WL. As a result, the trenchbetween adjacent word lines WL gets shallower. Here again, a portion ofthe coating film 14 a is left in the trench so that an aspect ratio ofthe trench is not more than 3, for examples Then, thermal processing at800□C. is performed on the semiconductor substrate 1 for about oneminute in a nitrogen gas atmosphere, for example, in order to make thecoating film 14 a finer. As a result, the film quality of the coatingfilm 14 a can be improved, which reduces its wet-etching rate. Afterthat, as shown in FIG. 24, an insulating film (a second insulating film)14 b made of a silicon oxide film, for example, is deposited on the mainsurface of the semiconductor substrate 1 by the CVD method, for example,using a mixture gas of tetraethoxysilane (TEOS) and ozone (O₃), or amixture gas of monosilane and oxygen, for example, in order to fill theremaining depth portion of the trench between adjacent word lines WL.Here, since the aspect ratio of the trench between adjacent word linesWL (remaining depth portion) is not more than 3, the trench can befilled where no holes, voids, or seams are formed in the insulating film14 b within the trench. Further, the deeper the trench is, the moreuneven the main surface of the semiconductor substrate 1 is. Thus, thedeposition thickness of the insulating film 14 b for filling the trenchmust be thicker to some extent in order to prevent unevenness on the topsurface of the insulating film 14 b. However, in this first embodiment,the depth of the trench between adjacent word lines WL is shallower dueto use of the coating film 14 a in advance so that the unevenness on themain surface of the semiconductor substrate 1 can be reduced. As aresult, the deposition thickness of the insulating film 14 b can bethinner. The insulating film 14 b is finer than the coating film 14 a inthe same manner as the insulating film 6 d.

Next, as shown in FIG. 25, the top surface of the insulating film 14 bis polished by the CMP method, for example, in order to flatten the topsurface. Then, as shown in FIG. 26, an insulating film 15 made ofsilicon oxide (SiO₂), for example, is deposited on the insulating film14 b by the CVD method, for example. The upper insulating film 15 isdeposited in order to repair fine flaws on the surface of the lowerinsulating film 14 b occurred when it is polished by the CMP method.Then, the insulating films 15 and 14 b and the coating film 14 a above an-type semiconductor region (source, drain) 12 of the MISFETQs formemory cell selection are sequentially removed by dry etching with thephoto-resist film being used as a mask. The etching is performed underthe condition that the etching selecting ratio between silicon oxide andsilicon nitride is increased so that silicon oxide is easier to beetched than silicon nitride. Thus, it is possible to prevent the siliconnitride film 13 below the coating film 14 a from being removed. Then,the silicon nitride film 13 above the n-type semiconductor region(source, drain) 12 is removed by dry etching with the photo-resist filmused as a mask. Subsequently, the thin gate insulating film 9 therebelowis removed. Thus, a contact hole 16 a is formed on one n-typesemiconductor region (source, drain) 12, and a contact hole 16 b isformed on the other one. The contact hole 16 a (contact hole on the ntype semiconductor region 12 shared by two MISFETQs for memory cellselection) has a long narrow pattern such that its planar dimension inthe word line WL extending direction is twice as long as the dimensionin the word line WL traversing direction. That is, the contact hole 16 ahas a planar, substantially rectangular-shaped pattern such that theplanar dimension in the word line WL extending direction is larger thanthe planar dimension in the word line WL width dimension, a part ofwhich extends onto the isolation portion 6 away from the active regionL. The etching is performed on the insulating film 13 made of siliconnitride, for example, under the condition that the etching selectingratio between silicon oxide and silicon nitride is increased so thatsilicon nitride is easier to be etched and removed than silicon oxide inorder to minimize the amount of grating of the semiconductor substrate 1and the isolation portion 6. Further, the etching is performed under thecondition where the insulating film 13 made of silicon nitride, forexample, is anisotropy-etched so as to leave the insulating film 13 madeof silicon nitride on the side wall of the gate electrode 10A (word lineWL). Thus, the contact holes 16 a and 16 b, which are as fine as theirdiameter in the word line WL width direction is under thephotolithography resolution limit, can be formed in self-aligned mannerwith respect to the gate electrode 10A (word line WL). After the contactholes 16 a and 16 b are formed, phosphorus, for example, may beion-implanted to the p-type well 8P through the contact holes 16 a and16 b so as to form the n-type semiconductor region 12A on the p-typewell 8P in a region deeper than the source and drain of the MISFETQs formemory cell selection. The n-type semiconductor region 12A can alleviatean electric field concentrated at an end portion of the source anddrain. Thus, leakage current at the end portion of the source and draincan be decreased to improve the refresh characteristic of the memorycells.

Next, a plug 17 is formed within the contact holes 16 a and 16 b. Theplug 17 is formed by depositing a polycrystal silicon film to whicharsenic (As), for example, is doped, on the semiconductor substrate 1 bythe CVD method, for example, polishing the polycrystal silicon film bythe CMP method, and then leaving it within the contact holes 16 a, 16 b.Subsequently, a semiconductor integrated circuit device is manufacturedin accordance with a general method of manufacturing a DRAM. A top viewand one example of sectional views taken on line A—A of a memory cellarray of the DRAM are shown in FIGS. 27 and 28, respectively.

An insulating film 18 made of silicon oxide, for example, is formed onthe insulating film 15. A through-hole 19 is formed on the insulatingfilm 18 above the contact hole 16 a located flat on the isolationportion 6 away from the active region L. Within the through-hole 19, aplug 20 is filled which is made of electrically conductive films where aTi (titan) film, a TiN (titan nitride) film and a W film are stackedfrom the bottom. Formed on an interface between the plug 20 and the plug7 filled in the contact hole 16 a under the through-hole 19 is atitansilicide (TiSi₂) layer generated by a reaction between the Ti filmforming a part of the plug 20 and the poly-crystal-silicon film formingthe plug 7. A bit line BL is formed on the insulating film 18. The bitline BL is arranged above the isolation portion 6 (a region sandwichedby active regions L) two-dimensionally and extends with a uniform widthand a uniform space linearly along the word line WL width direction. Thebit line BL is made of high melting point metal, such as tungsten, andis connected electrically with one of the source and drain of theMISFETQs for memory cell selection (the n-type semiconductor region 12,n type semiconductor region 12A shared by two MISFETQs for memory cellselection) through the through hole 19 formed in the insulating film 18and the contact hole 16 formed in the insulating films therebelow(insulating film 15 and 14 b, coating film 14 a and gate insulating film9). Forming the bit line BL with metal (such as tungsten) allows thereduction of its resistance, which further allows rapid reading andwriting of information. Further, since the bit line BL and a first layerwire of a peripheral circuit below can be formed simultaneously throughthe same process, the process for manufacturing the DRAM can besimplified. Forming the bit line. BL with metal (such as tangsten) withhigher heat-resistance and electro-migration resistance can preventdisconnection with certainly even if the width of the bit line BL isfiner.

Formed on the bit line BL and the first layer wire are insulating films21 and 22 made of silicon oxide (SiO₂), for example. The upperinsulating film 22 has a flat top surface. An insulating film 23 made ofsilicon nitride (Si₃N₄), for example, is formed on the insulating film22 of the memory cell array. A cylindrical (crown), for example,information storage capacitor element C is formed thereon. Theinformation storage capacitor element C has a bottom electrode (storageelectrode) 24 a, a top electrode (plate electrode) 24 b, and a capacitorinsulating film (dielectric film) 24 c made of tantalum oxide (Ta₂O₅)arranged therebetween. The bottom electrode 24 a is made of, forexample, a low resistant polycrystal silicon film to which phosphorus(P) is doped, while the top electrode 24 b is made of, for example, aTiN film. The bottom electrode 24 a of the information storage capacitorelement C is arranged in a long and narrow planar pattern extendingstraight along the word line width direction in FIG. 27. The bottomelectrode 24 a is electrically connected to the plug 17 within thecontact hole 16 b through a plug 26 filled within a through-hole 25,which passes through the insulating films 23, 22, 21, and 18. Further,it is electrically connected to the other one of the source and drain(n-type semiconductor region 12, n type semiconductor region 12A) of theMISFETQs for memory cell selection through the plug 27. The plug 26 madeof a low resistant polycrystal silicon film to which phosphorus (P) isdoped, tungsten or titan nitride, for example, is filled within thethrough hole 25 formed between the bottom electrode 24 a and the contacthole 16 b. Two insulating films 27 and 28 made of silicon oxide (SiO₂),for example, are formed at the top of the information storage capacitorelement C. Further, a second layer wire ML2 is formed thereon. Thesecond layer wire ML2 is made of an electrically conductive filmcontaining mainly aluminum (Al) alloy. An insulating film 29 made ofsilicon oxide (SiO₂), for example, is formed on the second layer wireML2. The insulating film 29 is formed by the high density plasma CVDmethod, which has an excellent gap-fill property for the second layerwire ML 2.

Second Embodiment

Before describing a second embodiment of the present invention, aproblem found by the present inventor will be described with referenceto FIG. 35. FIG. 35 shows a partial sectional view of a semiconductorsubstrate 50. FIG. 35 shows a case where there is a first isolationportion formed region S1 with a relatively large planar area and asecond isolation portion formed region S2 with relatively small planararea. The isolation trenches 51 a and 51 b are already formed in asemiconductor substrate 1 in the first and second isolation portionformed regions S1 and S2. Under this state, as described in the firstembodiment of the present invention, an insulating film for isolation isdeposited in two steps. That is, after a coating film 52 is deposited,an insulating film 53 is deposited sequentially from the bottom by theCVD method, for example. Thus, when the isolation trench 51 a in thefirst isolation portion formed region S1 with a larger planar area isfilled with the coating film to some extent, the isolation trench 51 bin the second isolation portion formed region S2 with a smaller planararea is filled completely thereby. When this happens, an isolationportion having the coating film 52 only is formed in the secondisolation portion formed region S2. Conversely, when the isolationtrench 51 b in the second isolation portion formed region S2 isprevented from being filled completely, the thickness of the coatingfilm 52 filled within the isolation trench 51 a in the first isolationportion formed region S1 gets thinner. As a result, the thickness of theinsulating film 53 to be deposited thereon must be thicker. When thethickness of the insulating film 53 is thicker, a polishing amount ofCMP for grating the insulating film 53 by CMP is increased. As a result,variations in the CMP polishing are caused.

Therefore, according to the second embodiment of the present invention,an arrangement will be described with reference to FIG. 29, which showsa plane view, during a process of manufacture, of a semiconductorintegrated circuit device, and FIG. 30, which shows a sectional viewtaken on line A—A in FIG. 29. A first isolation portion formed regionS1, with a relatively larger two-dimensional area, and a secondisolation portion formed area S2, with a relatively smalltwo-dimensional area, exist in a semiconductor substrate 1. An activeregion L is formed in an area surrounded by the first and the secondisolation portion formed regions S1 and S2. The active region L (activeregions LA, LB, LC) is located in a dummy inhibited area DA. The dummyinhibited area DA is designed so as to prevent a dummy pattern describedbelow from being located in the dummy inhibited area DA to whichelements should be located. An n-well, for example, is formed and a pMISis located in each of the active regions LA and LB. On the other hand, ap-well is formed and an nMIS is located in the active region LC. Gateelectrodes 31 a and 31 b shown in dashed lines are patterns formingthose MISFETs. The gate electrode 31 a is located longitudinally acrossthe active region LA. The gate electrode 31 b is located longitudinallyacross the active regions LB and LC.

According to the second embodiment of the present invention, dummypatterns 30 are provided in the first isolation portion formed region S1with a relatively larger two-dimensional area. That is, in the firstisolation portion formed region S1 with a relatively largertwo-dimensional area, an isolation trench 6 a is formed between adjacentdummy patterns 30. The structure can suppress or prevent the thicknessvariations of the insulating film with which the isolation trench 6 a isfilled as described later. The dummy patterns 30 are formed by leavingthe dummy patterns 30 when the isolation trench 6 a is formed. That is,the dummy patterns 30 are formed with parts of the semiconductorsubstrate 1. A two-dimensional shape of the dummy pattern 30 is formedas a square, for example. That is, in the first isolation portion formedregion S1, the isolation trench 6 a is formed in a two-dimensional gridmanner. Viewing the main surface of the semiconductor substrate 1 as awhole, and according to the second embodiment, the width of theisolation trench 6 a formed between adjacent dummy patterns 30 in thefirst isolation portion formed region S1 having the relatively largertwo-dimensional area, for example, is substantially equal to the widthof the isolation trench 6 a in the second isolation portion formedregion S2 having a relatively small two-dimensional area, for example(such as an isolation trench 6 a with the smallest two-dimensional area,here). Thus, isolation trenches 6 a with identical two-dimensionalpatterns are formed on the main surface of the semiconductor substrate 1as a whole. Further, the depth of the isolation trench 6 a is uniform inthe first and the second isolation portion formed regions S1 and S2.This is for improving the uniformity of the thickness of the insulatingfilm with which the isolation trench 6 a is filled. The width and thedepth of the isolation trench 6 a are about 70 μm, for example, andabout 500 nm, for example, respectively. The aspect ratio is not lessthan 7, for example. The isolation trenches 6 a in the first and thesecond isolation portion formed regions are formed by the same method asthe one described in the first embodiment during the same process.Forming them during the same process allows the dummy patterns 30 to beformed more easily. The insulating films 2 and 6 b are formed on thesurface of the semiconductor substrate 1, including dummy patterns 30,by the same methods as the one described for the first embodiment,respectively. Further, an insulating film 3 is formed on the insulatingfilm 2 by the same method as the one described for the first embodiment.

In the second embodiment of the present invention, as shown in FIG. 31,the isolation trench 6 a is filled by depositing the coating film 6 c onthe main surface of the semiconductor substrate 1 in the same manner asfor the first embodiment. Then, as shown in FIG. 32, the insulating film3 is used as an etching mask to etch and remove the coating film 6 c soas to leave a portion of the coating film 6 c up to a predeterminedmiddle position in the depth direction of the isolation trench 6 a. As aresult, the isolation trench 6 a is made shallower. Here, a portion ofthe coating film 6 c is left in the isolation trench 6 a such that thedepth of the isolation trench 6 a is not more than about 210 nm, forexample, that is, the aspect ratio is not more than 3. In the secondembodiment, the dummy patterns 30 are provided in the first isolationportion formed region S1 having the relatively large area so that thethicknesses, or heights, of the insulating film 6 c left within theisolation trench 6 a in the first isolation portion formed region S1having the relatively large area and the insulating film 6 c left withinthe isolation trench 6 a in the second isolation portion formed regionS2 with the relatively small area can be substantially equal. That is,at this stage, the thickness of the insulating films 6 c on the mainsurface of the semiconductor substrate 1 can be substantially equal.

Subsequently, thermal processing at 800 □C for about one minute, forexample, is performed on the semiconductor substrate 1 in a nitrogen gasatmosphere, for example. This can improve the quality of the coatingfilm 6 c. After the wet etching rate is reduced, as shown in FIG. 33, aninsulating film 6 d is deposited on the main surface of thesemiconductor substrate 1 in the same manner as for the first embodimentin order to fill the remaining depth portion of the isolation trench 6a. Here, since the aspect ratio of the isolation trench 6 a (remainingdepth portion) is not more than 3, the isolation trench 6 a can befilled such that no holes, voids or seams are formed in the insulatingfilm 6 d within the isolation trench 6 a.

Furthermore, when the isolation trench 6 a is deep, the main surface ofthe semiconductor substrate 1 gets more uneven. In addition, the mainsurface of the semiconductor substrate 1 can be uneven due to variationsin thickness of the insulating film 6 c when there are isolation regionswith different two-dimensional areas relatively in the semiconductorsubstrate 1. In that case, the deposition thickness of the insulatingfilm 6 d must be thickened to some extent in order to prevent unevennesson the top surface of the insulating film 6 d. However, in the secondembodiment, the depth of the isolation trench 6 a is reduced by usingthe coating film 6 c in advance so that the unevenness on the mainsurface of the semiconductor substrate 1 can be reduced. Therefore, thedeposition thickness of the insulating film 6 d also can be reduced.Further, the dummy patterns 30 are provided in advance in the firstisolation portion formed region S1 having a relatively largetwo-dimensional area so that the thickness of the insulating film 6 cfilled in the isolation trench 6 a can be uniform regardless of adifference between the two dimensional area sizes of the isolationportion formed regions (the first and the second isolation portionformed regions S1 and S2, for example). Therefore, the thickness of theinsulating film 6 d can be relatively thin.

Next, as shown in FIG. 34, the insulating film 3 is used as an etchingstopper to polish the insulating films 6 d by the CMP method. Here, alsoin the second embodiment, the deposition thickness of the insulatingfilm 6 d can be thinner as described above. Thus, the amount ofpolishing of the insulating films 6 d by CMP can be reduced, which canreduce polishing variations produced by CMP. Then, etching processing isperformed on the semiconductor substrate 1 in order to etch and removethe insulating films 2 and 3. As a result, the isolation portions 6 witha trench filled structure are formed. By forming the isolation portions6, active regions L with a long and narrow island-shaped patternsurrounded by the isolation portion 6 are formed at the same time. Thetop surface of the isolation portion 6, that is, the top surface of theinsulating film 6 d is flattened like the first embodiment so as to beat substantially the same level with the top surface of the activeregion L. No holes, voids and seams are formed at the top surface of theinsulating film 6 d.

Third Embodiment

As shown in FIG. 36, dummy gate electrodes 10B (DG) are provided in athird embodiment, which are in the same layer as the gate electrodes 10A(G) in the first and second embodiments. Thus, the thickness of coatingfilms 14 a on the main surface of the semiconductor substrate 1 can besubstantially uniform. As a result, the deposition thickness of theinsulating film 14 b is reduced so that the amount of polishing by theCMP method can be reduced. Here, the dummy gate electrodes 10B (DG) canbe arranged in the same manner as the dummy patterns 30 in the secondembodiment. The dummy gate electrodes 10B (DG) can be formed into thesame structure as that of the gate electrodes 10A by changing the maskpattern of the photo-resist film for forming the gate electrodes 10A inthe first and second embodiments.

A method of manufacturing the semiconductor integrated circuit deviceaccording to the third embodiment includes the steps of (a) forming aplurality of patterns, including gate electrodes 10A and dummy gateelectrodes 10B of MISFETQs and, arranged adjacent to each other on asemiconductor substrate; (b) filling a trench formed between theplurality of patterns adjacent to each other up to a predeterminedmiddle position in its depth direction with a first insulating film 14 adeposited by a coating method; and (c) filling a remaining depth portionof the trench into which the first insulating film 14 a has been filledwith a second insulating film 14 b.

In the method of manufacturing the semiconductor integrated circuitdevice described above, the second insulating film is deposited by thechemical vapor deposition method.

As described above, the present invention has been describedspecifically based on the various embodiments. However, the presentinvention is not limited to the first, second and third embodiments andcan be changed in various manners without departing from its principle.

For example, while the first, second and third embodiments describe acase where the semiconductor substrate has a simple structure withsilicon single crystal, the present invention is not limited to suchcase and can be changed in various ways. For example, it may include anepitaxial wafer in which an epitaxial layer is formed on a surface of asilicon-on-insulator (SOI) substrate or a semiconductor substrate towhich a semiconductor layer for forming elements on an insulating layeris provided.

While, in the first, second and third embodiments, the coating film isetched back so as to be left within the isolation trench, no limitationto this technique is intended. For example, the coating film may becoated so as to fill only a bottom portion of the isolation trench up toa predetermined middle depth when coating the coating film. In thiscase, the etch-back step can be eliminated, the process can besimplified. Further, since variations by the etch-back processing can beeliminated. Thus, total variations in manufacturing the semiconductorintegrated circuit device can be reduced. Accordingly, the yield andreliability of the semiconductor integrated circuit device can beimproved.

While the description has been given of a case where the presentinvention is applied to a DRAM, which is the background applicationfield of the present invention, no limitation is intended. The presentinvention may be applied to a semiconductor device having a memorycircuit, such as a static random access memory (SRAM) and a flash memory(electric erasable programmable read only memory: EEPROM), or to asemiconductor device having a logic circuit, such as a microprocessor.Alternatively, it may be applied to a hybrid semiconductor deviceincluding both a memory circuit and a logic circuit on an identicalsemiconductor substrate. Furthermore, it may be applied to technologyfor manufacturing a semiconductor integrated circuit device manufacturedon another insulating substrate, such as the glass of atin-film-transistor (TFT) and super-twisted-nematic (STN) liquidcrystal, for example.

Typical effects obtained by the present invention disclosed herein maybe described simply as follows:

(1) According to the present invention, no holes and the like are formedat a top portion of an insulating film to be filled within an isolationtrench so that the isolation trench can be filled well with theinsulating film.

(2) According to the present invention, no holes and the like are formedat a top portion of an insulating film to be filled within a trenchbetween adjacent patterns so that the trench can be filled well with theinsulating film.

(3) According to (1) and (2) above, a short circuit failure betweenelectrode wires can be prevented.

(4) According to the present invention, the thickness of an insulatingfilm to be filled in the isolation trench can be reduced so that theamount of polishing of the insulating film can be reduced. Therefore,variations in polishing the insulating film can be reduced.

(5) According to the present invention, dummy patterns are provided inan isolation portion formed region having a relatively largetwo-dimensional area so that the thicknesses of an insulating filmformed by a coating method and an insulating film formed by a chemicalvapor deposition method can be uniform and reduced. As a result, theamount of polishing of the insulating film formed by the chemical vapordeposition method can be reduced. Therefore, variations in polishing theinsulating film can be reduced.

(6) According to (3), (4) and (5), the reliability of a semiconductorintegrated circuit device can be enhanced.

(7) According to (3), (4) and (5), the yield of a semiconductorintegrated circuit device can be enhanced.

1. A method for manufacturing a semiconductor integrated circuit device,comprising the steps of: (a) forming an element isolation trench in afirst element isolation region and in a second element isolation regionwhich is larger than said first element isolation region, of asemiconductor substrate; (b) filling said isolation trench up to apredetermined position in its depth direction with a first insulatingfilm deposited by a coating method; (c) depositing a second insulatingfilm on a main surface of said semiconductor substrate by a chemicalvapor deposition method so as to fill a remaining depth portion of saidisolation trench; and (d) polishing said second insulating film on themain surface of said semiconductor substrate by a chemical mechanicalpolishing method; wherein dummy patterns are provided in said secondelement isolation region before said first insulating film is deposited,and wherein an etching rate of said second insulating film is lower thanthat of said first insulating film.
 2. A method for manufacturing asemiconductor integrated circuit device according to claim 1, whereinsaid first insulating film is filled into said element isolation trenchat said step (b) such that a thickness of said first insulating film isuniform within said isolation trench formed in said first elementisolation region and in said second element isolation region.
 3. Amethod for manufacturing a semiconductor integrated circuit deviceaccording to claim 1, wherein said dummy patterns are provided in saidsecond element isolation region such that a plurality of regions betweensaid dummy patterns smaller than said second element isolation regionare formed in said second element isolation region.
 4. A method formanufacturing a semiconductor integrated circuit device according toclaim 1, wherein said first insulating film is a spin-on-glass film, andsaid second insulating film is filled into said remaining depth portionof said isolation trench by a chemical vapor deposition method.
 5. Amethod for manufacturing a semiconductor integrated circuit deviceaccording to claim 1, wherein said step (b) comprises the steps ofdepositing said first insulating film on the main surface of saidsemiconductor substrate by a rotary coating method such that thedeposited first insulating film has a planarized surface, and thenetching back said first insulating film.
 6. A method for manufacturing asemiconductor integrated circuit device according to claim 5, whereinsaid step (b) further comprises the step of performing thermalprocessing on said semiconductor substrate after the step of etchingback said first insulating film before said step (c).
 7. A method formanufacturing a semiconductor integrated circuit device according toclaim 1, said first element isolation region is between active regions,and each element is provided in said active regions.
 8. A method formanufacturing a semiconductor integrated circuit device, comprising thesteps of: (a) forming an isolation trench in a first element isolationregion, and in a second element isolation region which is larger thansaid first element isolation region, of a semiconductor substrate, so asto form a plurality of trenches in said second element isolation regionin a section of said semiconductor substrate; (b) filling said isolationtrench up to a predetermined position in its depth direction with afirst insulating film deposited by a coating method; (c) depositing asecond insulating film on a main surface of said semiconductor substrateby a chemical vapor deposition method so as to fill a remaining depthportion of said isolation trench; and (d) polishing said secondinsulating film on said main surface of said semiconductor substrate bya chemical mechanical polishing method, wherein an etching rate of saidsecond insulation film is lower than that of said first insulating film.9. A method for manufacturing a semiconductor integrated circuit deviceaccording to claim 8, further comprising a step of forming an element inan active region between said first element isolation region and saidsecond element isolation region.
 10. A method for manufacturing asemiconductor integrated circuit device according to claim 8, whereinsaid first element isolation region is between a first active region anda second active region, and said first active region and said secondactive region are surrounded by said second element isolation region.11. A method for manufacturing a semiconductor integrated circuit deviceaccording to claim 8, wherein dummy patterns are formed between saidtrenches in said section by means of forming said trench in said step(a).
 12. A method for manufacturing a semiconductor integrated circuitdevice, comprising the steps of: (a) forming an element isolation trenchin a first element isolation region and in a second element isolationregion which is larger than said first element isolation region, of asemiconductor substrate; (b) filling said isolation trench up to apredetermined position in its depth direction with a first insulatingfilm deposited by a coating method; (c) depositing a second insulatingfilm on a main surface of said semiconductor substrate by a chemicalvapor deposition method so as to fill a remaining depth portion of saidisolation trench; and (d) polishing said second insulating film on themain surface of said semiconductor substrate by a chemical mechanicalpolishing method; wherein dummy patterns are provided in said secondelement isolation region before said first insulating film is deposited,wherein said step (b) comprises the steps of depositing said firstinsulating film on the main surface of said semiconductor substrate by arotary coating method such that the deposited first insulating film hasa planarized surface, and then etching back said first insulating film,and wherein said step (b) further comprises the step of performingthermal processing on said semiconductor substrate after the step ofetching back said first insulating film and before said step (c).